TAB's/COF's/FPC's used to repair LCD panel may be new or may have been taken from scrap panels and carefully cleaned.  These devices are attached to the LCD glass with the ACF by applying heat and pressure for a specific time period. Most of these devices are also attached to their PCBAs in the same manner but occasionally solder bonds are used on older panels. Prior to bonding, the ACF is tacked to the device by applying a reduced heat and pressure for a specific time period. Consult the bonding information on the datasheet for the tacking site, tape, tacking pressure and tacking PSI. If a glass tacking site is indicated instead of tacking on the device, proceed to the bonding process where the ACF will be bonded directly onto the glass. If tacking on the device is indicated then proceed with the following steps.

Specification
110/240V
Require airline of 60 psi