Horizontal lines, vertical lines, or missing bands of video are usually the result of Driver failures. The column failures stop at the center of the LCD screen because the Column Drivers drive only half the screen. Column Drivers on active panels drive all the way across the screen.When replacing device drivers, the most critical bonding process take place on the glass. These bonds are performed prior to any PCBA bonds. Glass bonding will be performed on the Alignment Bonding System. Ensure that it is properly set-up and align for TAB/COF/FPC bonding per OEM specification. Each specific profile can be programmed thru computer or to the controller. These profiles control the time and temperature of the bond. If there are Column Drivers located on the top and bottom of an active panel, they are divided so that edge drives the even column lines and one edge drives the odd column lines. TFT failures occur on active panels and are characterized by a line running part way across the screen and stopping. TFT failures are not repairable. Etch failures similar to Driver line failures but are not repairable. The only way to differentiate between a Driver line failure and an etch is to remove the Driver and examine the glass. Since that process can only be performed during the Driver Replacement Process, the failure will be recorded as a Driver failure until it can be otherwise confirmed. It should also be noted that on some panels a failing Driver may eliminate all video. In these cases the failure is listed as a Video failure until advanced diagnostics confirm it is a Driver failure.   The thousands of pixels on an LCD are controlled by driver circuitry. There are several competing technologies used to accommodate the driver circuitry. TABs (Tape Automated Bond) or TCPs (Tape Carrier Package) are two names for the most common of the technologies. TABs/TCPs consist of small ICs mounted onto a flexible brown, nontransparent polyimide material. COFs (Chips on Flex) are a newer technology that is similar to TABs but instead of the polyimide, a thinner, transparent flexible kapton material is used. In COGs (Chips on Glass) technology the ICs are mounted directly on the glass.  Polysilicon technology which we call CIG (Chip in Glass) the driver circuitry is fabricated as part of the glass. Both COG and CIG rely on FPCs (Flexible Printed Circuits) to connect the rest of the video circuitry to the driver circuitry on the glass. All of these technologies require highly specialized processes and equipment to properly perform repair work. These are described in the following sections. Use extreme care when handling the open LCDs to prevent damage to the polarizers and the good drivers.

Specification:
110/240V
Semi Automatic
Optical magnifications up to 10x
Requires airline of 100 psi
Color CCD Camera (NTSC)